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Figure 2. Microsystem chip before and after encapsulation into a smart bracket. (A) (left) Micrograph of the sensor chip (used for construction of the smart bracket) with 32 stress sensors distributed over the chip area, analogue signal conditioning, and digital control unit. Center: sensor element with switches. Right: octagonal sensor with 8 contacts allowing for application of the spinning-current method. (B) Schematic illustration (cross-section) of the smart bracket model. The sensor chip was wire-bonded to a printed circuit board and encapsulated in a plastic bracket. (C) Photograph of the manufactured smart bracket with a base of 8 x 8 mm2 (scale of approximately 2.5:1 compared with normal bracket size). For the mechanical experiments, the archwire was adhesively attached.
