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Figure 1. Double-bond conversion vs. time (a) and shrinkage stress vs. time (b) for Bis-GMA/TEGDMA/OX-50 (49/21/30 by wt; Initiator, CQ 0.21 wt%; EDAB, 0.56 wt%) cured with 3 different curing protocols at T0 = 23°C: STAN, 450 mW/cm2 for 60 sec (); SOFT, 100 mW/cm2 for 5 sec, followed by 450 mW/cm2 for 60 sec ( ); PULSE, 100 mW/cm2 for 5 sec, wait for 2 min, followed by 450 mW/cm2 for 60 sec (...). Vertical bar represents standard deviation. Estimate of variability is shown in the Table (n = 3).
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