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Journal of Dental Research, Vol 55, 772-777, Copyright © 1976 by International & American Associations for Dental Research Online Journals
ARTICLES |
A. M. Weinstein, J. J. Klawitter, S. C. Anand and R. Schuessler
A model based on a continuously bonded interface predicts high punching stresses at the apex of the implant and low stresses in the cortical plates. A model based on a continuously bonded interface predicts high stiffness and a resultant low implant displacement-load ratio. A model based on a tissue ingrowth-bonded interface predicts uniform distribution of stresses around the implant through the cortical plates. A model based on a tissue ingrowth-bonded interface predicts an implant displacement-load ratio close to the ratio measured with actual implant specimens.
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