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J Dent Res 48(5): 872-878, 1969
© 1969 International and American Associations for Dental Research
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Microanalysis of Copper-Tin Phases in Dental Amalgam

LEONARD N. JOHNSON 1, KAMAL ASGAR 1, and FLOYD A. PEYTON 1

1 Department of Dental Materials, School of Dentistry, University of Michigan, Ann Arbor, Michigan 48104

An etch resistance phase was found in dental silver amalgam when the amalgam was examined metallographically. This phase was common to the silver alloy ingot as well as to its prepared amalgam. Qualitative electron microprobe technics were used to identify this phase. Quantitative electron microprobe analysis defined it as the eegr' phase of the copper-tin system or the intermetallic compound Cu6Sn5.

Submitted on June 19, 1968






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