Figure 4. FE-SEM micrographs of bonded interfaces in Clearfil Protect Bond that were created by application of the adhesive with the experimental electric-assisted technique (a,c), or in accordance with the manufacturers’ instructions (b,d). Differences in number and dimension of silver deposits between test and control were lower than in simplified self-etching adhesives. Hybrid layer created under the effect of electric current revealed almost no silver deposits along the interface (A). Controls showed small clusters of silver grains with a diameter of 0.5–2 µm, mainly localized at the peritubular level, and apparently localized within areas of different electron density, probably due to phase separation (B). High-magnification views reveal a similar phenomenon also occurring in test specimens (C), while scattered silver deposits were fond homogenously within the adhesive layer of both test and control groups (D). Dentin (D), adhesive (A).